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Modular Power Architecture for Next-Generation Energy Systems

SolMOS is being developed to improve switching efficiency, thermal performance, scalability, and protection within high-power electronic systems.

Industry Challenge

Close-up of a sleek, compact power converter unit with glowing LED indicators.
Close-up of a sleek, compact power converter unit with glowing LED indicators.

Modern electrification systems require increasingly efficient, compact, and reliable power conversion. Traditional architectures often face challenges with thermal management, scalability, protection, and current balancing under demanding conditions.

SolMOS

SolMOS is a modular power architecture designed to simplify high-power system integration. Built around scalable switching modules, it focuses on current-sharing optimization, thermal-aware design, and integrated protection principles. The platform is device-flexible today, while creating a future pathway toward custom semiconductor integration.

Close-up of a modular power switching unit glowing softly, showcasing intricate circuits and cooling elements.
Close-up of a modular power switching unit glowing softly, showcasing intricate circuits and cooling elements.

Technical Concepts

A sleek, modern circuit board illustrating modular power components interconnected.
A sleek, modern circuit board illustrating modular power components interconnected.
Modular Design

Flexible modules that adapt to your power needs.

Current Sharing

Balances electrical loads across switching elements.

Future SiC Integration

Long-term pathway toward silicon carbide semiconductor implementation.

Protection Systems
Thermal Efficiency
Scalable Switching

Architecture intended to support sensing, monitoring, and fault protection.

Built for future high-power and high-efficiency applications.

Smart heat distribution keeps systems cool.

Developmental Approach

Helionix is prioritizing iterative engineering validation through prototype development, testing, and system-level refinement before pursuing advanced semiconductor fabrication.

Technical Roadmap

Discrete MOSFET prototype validation

Phase 1

Phase 2

Phase 4

Phase 3

Phase 5

Current-sharing and thermal testing

OEM collaboration and application testing

Advanced semiconductor integration

Protection and sensing refinement

Extreme close-up macro of a silicon carbide die under studio strobe lighting, bond wires and gate traces sharply resolved, deep black background, hard-edge shadows revealing surface topology, overhead framing with semiconductor wafer texture visible
Extreme close-up macro of a silicon carbide die under studio strobe lighting, bond wires and gate traces sharply resolved, deep black background, hard-edge shadows revealing surface topology, overhead framing with semiconductor wafer texture visible
Request Data Sheet
/ SolMOS Architecture

One integrated power architecture. No multi-vendor validation burden.
SolMOS reduces integration complexity while improving scalability and reliability.

SolMOS combines high-performance switching, thermal management, and protection within a unified power architecture engineered to minimize parasitic inductance and optimize gate drive behavior at the system level rather than through post-assembly integration.

Cross-sectional cutaway photograph of a power electronics module on a test bench, circuit board trace layers and thermal interface material visible in section, documentary shop lighting with hard shadows, overhead angle showing layered substrate detail and copper interconnects
Cross-sectional cutaway photograph of a power electronics module on a test bench, circuit board trace layers and thermal interface material visible in section, documentary shop lighting with hard shadows, overhead angle showing layered substrate detail and copper interconnects
— Switching Loop Design

The breakthrough is not the silicon alone—it is the system architecture built around it. SolMOS co-designs switching, thermal flow, protection, and control as one platform.

SolMOS integrates gate drive impedance control and commutation loop optimization directly into the substrate architecture, reducing dependence on post-assembly compensation and improving high-speed switching stability.

One subsystem. Three co-designed functions.

One qualified BOM. One integrated power architecture.
SolMOS reduces integration debt by combining switching, thermal management, and protection into a unified scalable platform.

Thermal false-color infrared imaging of a power module under full switching load, vivid orange-to-blue temperature gradient map visible across die surface, test bench context with measurement probes at frame edge, no text overlays
Thermal false-color infrared imaging of a power module under full switching load, vivid orange-to-blue temperature gradient map visible across die surface, test bench context with measurement probes at frame edge, no text overlays

▸ Thermal Boundary

Thermal management within SolMOS is engineered for sustained operational load conditions

Junction-to-case thermal resistance

Aerospace and defense

SolMOS is being engineered for qualification under real operating conditions across temperature, voltage, and switching-frequency ranges representative of mission-critical power systems.

Thermal flow is engineered directly into the SolMOS switching substrate, reducing reliance on external TIM stacks and improving sustained thermal performance.

Why it Matters

As electrification expands globally, the demand for scalable, efficient, and intelligent power architectures continues to grow. Helionix aims to contribute to the next generation of advanced energy infrastructure through modular power innovation.